Product parameters:
Model: OC-TD-01
Material: Aluminum
Color: Silver
Size:198mm*74mm*14mm (without water nozzle)
Outer diameter of the interface: 10.5mm
Process: One-piece aluminum welding
Net weight: 300g
Application: Semiconductor chips for mechanical equipment, cellphone, tablets and other small water cooling systems
Features:
The OC-TD-01 water cold plate is made of all aluminum and welded in one. It is used for the heat dissipation of semiconductor chips. Nozzle fixed in one, reduce the possibility of liquid leakage in the process of use, prolong the service life.
Tip:
1. Before selecting a product, confirm the position of the screw hole on the device.
2. If you have any questions about the product, please contact us.
