Core selling point
2. Optimized diagonal inlet/outlet layout with dual G1/4 threaded ports ensures balanced coolant flow across the entire base plate, eliminating dead zones and hot spots for stable uniform temperature control in high-density computing systems and power electronics.
3. Universal X-shaped mounting bracket with four slotted adjustment holes fits multiple board standards and mounting patterns, enabling flexible installation on server motherboards, industrial control boards, and power converter modules without custom tooling.
4. Low flow resistance channel design minimizes pump load and pressure drop, allowing seamless integration into existing chiller loops and pump-reservoir systems while maintaining high flow rate and efficient heat rejection across the cooling circuit.
5. Anti-corrosion surface treatment with precision O-ring sealing guarantees leak-proof operation and long-term reliability, protecting sensitive electronics from coolant damage in medical equipment, semiconductor tools, and mission-critical data centers.
6. Compact square profile with chamfered edges fits space-constrained enclosures and standard mounting holes, making it ideal for OEM integration into laser controllers, EV charging power modules, and edge computing units requiring dense thermal management.
Product Parameters
Model: OC-S06-M
Material: Metal cover + Copper base
Supported platform: INTEL and AMD full platform
Appearance Size: 50*50*15.5mm (Length * Width * Height)
Interface Type: G1/4 thread
Color: Black/Gold/Silver
Weight: About 0.45KG (including packaging)
Surface Treatment: Metal matte anodizing, good texture
Tip: if you need INTEL LGA2011 platform, please contact us.
